Tungsten Products

  Molybdenum Products

  Tungsten Electrodes

  Heat Sinks of Electronic     Packaging



    Tungsten Copper       Composite(WCu)

    Molybdenum Copper



    Glid Copper

    Oxygen-free Copper(OFC)

    Low CTE Alloys
Current Position: Home >> Products >> Heat Sinks >> Molybdenum (Mo)   (Click on the small picture to enlarge)
Product Brief Introduction:
Molybdenum is similar to Tungsten, with melting point of 2,620 ℃(4,753oF), a little lower than tungsten. The elongation ability is better than Tungsten, and it is easier to make the thin wires and thin foils.

It has the lowest coefficient of thermal expansion (CTE) of any pure metals, its CTE matches well with semiconductor materials, such as, Si, GaN, GaAs, Al2O3.

Product Properties:
Density: 10.2g/cm3
Melting Poing: 2620 ℃
CTE (20-2000℃): 4.9μm.m-1.k-1
Thermal Conductivity: 138 W.m.m-1.k-1

Similar applications with Tungsten.

ATTL Advanced Materials Co., Ltd.  Copyright ©2017  All Rights Reserved Beijing ICP No.16033339  SiteMaps
Tel: 0086-22-59213388(ext. 681,682,684,688) Fax: 0086-22-59215599 Email: [email protected] [email protected]  Website: www.attl.cn  www.rloxfk.live